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Z0103MA, Z0107MA, Z0109MA Sensitive Gate Triacs Series
Silicon Bidirectional Thyristors
Designed for use in solid state relays, MPU interface, TTL logic and any other light industrial or consumer application. Supplied in an inexpensive TO-92 package which is readily adaptable for use in automatic insertion equipment.
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* One-Piece, Injection-Molded Package * Blocking Voltage to 600 V * Sensitive Gate Triggering in Four Trigger Modes (Quadrants) for all * * * * *
TRIACS 1.0 AMPERE RMS 600 VOLTS
MT2 G MT1
possible Combinations of Trigger Sources, and especially for Circuits that Source Gate Drives All Diffused and Glassivated Junctions for Maximum Uniformity of Parameters and Reliability Improved Noise Immunity (dv/dt Minimum of 10 V/msec at 110C) Commutating di/dt of 1.6 A/msec at 110C High Surge Current of 8 A These are Pb-Free Devices
3 STRAIGHT LEAD BULK PACK
12
1
MAXIMUM RATINGS (TJ = 25C unless otherwise noted)
Rating Peak Repetitive Off-State Voltage (TJ = -40 to +125C)(1) Sine Wave 50 to 60 Hz, Gate Open On-State RMS Current Full Cycle Sine Wave 50 to 60 Hz (TC = +50C) Peak Non-Repetitive Surge Current One Full Cycle, Sine Wave 60 Hz (TC = 110C) Circuit Fusing Considerations (t = 8.3 ms) Average Gate Power (TC = 80C, t v 8.3 ms) Peak Gate Current (t v 20 ms, TJ = +125C) Operating Junction Temperature Range Storage Temperature Range Symbol VDRM, VRRM IT(RMS) Value 600 Unit V
3 BENT LEAD TAPE & REEL AMMO PACK
2
TO-92 (TO-226AA) CASE 029 STYLE 12
MARKING DIAGRAM
1.0 A Z01 10xMA YWW G G
ITSM
8.0
A
I2t PG(AV) IGM TJ Tstg
0.35 1.0 1.0 -40 to +125 -40 to +150
A2s W A C C
1 23 x = 3,7,9 Y = Year WW = Work Week G = Pb-Free Package (Note: Microdot may be in either location)
PIN ASSIGNMENT
1 2 3 Main Terminal 1 Gate Main Terminal 2
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. VDRM and VRRM for all types can be applied on a continuous basis. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded.
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet.
(c) Semiconductor Components Industries, LLC, 2009
June, 2009- Rev. 2
1
Publication Order Number: Z0103MA/D
Z0103MA, Z0107MA, Z0109MA
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient Maximum Lead Temperature for Soldering Purposes for 10 Seconds Symbol RqJC RqJA TL Max 50 160 260 Unit C/W C/W C
ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted; Electricals apply in both directions)
Characteristic OFF CHARACTERISTICS Peak Repetitive Blocking Current (VD = Rated VDRM, VRRM; Gate Open) ON CHARACTERISTICS Peak On-State Voltage (ITM = "1.4 A Peak; Pulse Width v 2.0 ms, Duty Cycle v 2.0%) Gate Trigger Current (Continuous dc) (Z0103MA) (VD = 12 Vdc, RL = 30 W) MT2(+), G(+) MT2(+), G(-) MT2(-), G(-) MT2(-), G(+) Gate Trigger Current (Continuous dc) (Z0107MA) (VD = 12 Vdc, RL = 30 W) MT2(+), G(+) MT2(+), G(-) MT2(-), G(-) MT2(-), G(+) Gate Trigger Current (Continuous dc) (Z0109MA) (VD = 12 Vdc, RL = 30 W) MT2(+), G(+) MT2(+), G(-) MT2(-), G(-) MT2(-), G(+) Latching Current (VD = 12 V, IG = 1.2 x IGT) (Z0103MA) MT2(+), G(+) All Types MT2(+), G(-) All Types MT2(-), G(-) All Types MT2(-), G(+) All Types Latching Current (VD = 12 V, IG = 1.2 x IGT) (Z0107MA) MT2(+), G(+) All Types MT2(+), G(-) All Types MT2(-), G(-) All Types MT2(-), G(+) All Types Latching Current (VD = 12 V, IG = 1.2 x IGT) (Z0109MA) MT2(+), G(+) All Types MT2(+), G(-) All Types MT2(-), G(-) All Types MT2(-), G(+) All Types Gate Trigger Voltage (Continuous dc) (Z0103MA, Z0107MA, Z0109MA) (VD = 12 Vdc, RL = 30 W) MT2(+), G(+) All Types MT2(+), G(-) All Types MT2(-), G(-) All Types MT2(-), G(+) All Types Gate Non-Trigger Voltage (Z0103MA, Z0107MA, Z0109MA) (VD = 12 V, RL = 30 W, TJ = 125C) All Four Quadrants Holding Current (VD = 12 Vdc, Initiating Current = 50 mA, Gate Open) (Z0103MA) (Z0107MA, Z0109MA) VTM IGT 0.15 0.15 0.15 0.25 IGT 0.15 0.15 0.15 0.25 IGT 0.15 0.15 0.15 0.25 IL - - - - - - - - - - - - - - - - - - - - - - - - - - - - 10 10 10 10 7.0 15 7.0 7.0 10 20 10 10 15 25 15 15 mA - - - - 5.0 5.0 5.0 7.0 mA - - - - 3.0 3.0 3.0 5.0 mA - - 1.56 V mA TJ = 25C TJ = +125C IDRM, IRRM - - - - 5.0 500 mA Symbol Min Typ Max Unit
IL
mA
IL
mA
VGT - - - - VGD 0.2 - - - - - 1.3 1.3 1.3 1.3 1.3
V
V
IH
- -
- -
7.0 10
mA
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Z0103MA, Z0107MA, Z0109MA
ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted; Electricals apply in both directions)
Characteristic DYNAMIC CHARACTERISTICS Rate of Change of Commutating Current (VD = 400 V, ITM = 0.84 A, Commutating dv/dt = 1.5 V/ms, Gate Open, TJ = 110C, f = 250 Hz, with Snubber) Critical Rate of Rise of Off-State Voltage (VD = 67% Rated VDRM, Exponential Waveform, Gate Open, TJ = 110C) Z0103MA Z0107MA Z0109MA di/dt di/dt(c) 1.6 - - A/ms Symbol Min Typ Max Unit
dv/dt 10 20 50 - 30 60 75 - - - - 20
V/ms
Repetitive Critical Rate of Rise of On-State Current, TJ = 125C Pulse Width = 20 ms, IPKmax = 15 A, diG/dt = 1 A/ms, f = 60 Hz
A/ms
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Z0103MA, Z0107MA, Z0109MA
Voltage Current Characteristic of Triacs (Bidirectional Device)
+ Current Quadrant 1 MainTerminal 2 +
Symbol
VDRM IDRM VRRM IRRM VTM IH
Parameter
Peak Repetitive Forward Off State Voltage Peak Forward Blocking Current Peak Repetitive Reverse Off State Voltage Peak Reverse Blocking Current Maximum On State Voltage Holding Current Quadrant 3 MainTerminal 2 - IH VTM IRRM at VRRM on state IH
VTM
off state
+ Voltage IDRM at VDRM
Quadrant Definitions for a Triac
MT2 POSITIVE (Positive Half Cycle) + (+) MT2 (+) MT2
Quadrant II
(-) IGT GATE MT1 REF
(+) IGT GATE MT1 REF
Quadrant I
IGT - (-) MT2 (-) MT2
+ IGT
Quadrant III
(-) IGT GATE MT1 REF
(+) IGT GATE MT1 REF - MT2 NEGATIVE (Negative Half Cycle)
Quadrant IV
All polarities are referenced to MT1. With in-phase signals (using standard AC lines) quadrants I and III are used.
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Z0103MA, Z0107MA, Z0109MA
TC, MAXIMUM ALLOWABLE CASE TEMPERATURE ( C) 110 I T(RMS) , MAXIMUM ALLOWABLE AMBIENT TEMPERATURE ( C) T = 30 60 DC 80 180 70 60 50 40 30 0 a a = CONDUCTION ANGLE 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 a 120 90 110 100 90 80 70 60 50 40 30 20 IT(RMS), RMS ON-STATE CURRENT (AMPS) 0 a a = CONDUCTION ANGLE 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 a DC 180 120 T = 30 60 90
100 90
IT(RMS), RMS ON-STATE CURRENT (AMPS)
Figure 1. RMS Current Derating
Figure 2. RMS Current Derating
P(AV), MAXIMUM AVERAGE POWER DISSIPATION (WATTS)
1.2 1.0 0.8 0.6 a a = CONDUCTION ANGLE 120 a DC 180
6.0 4.0 TJ = 110C 2.0 25C
1.0 90 0.2 T = 30 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 60 ITM, INSTANTANEOUS ONSTATE CURRENT (AMP) 0.4 0.6 0.4
IT(RMS), RMS ON-STATE CURRENT (AMPS)
0.2
Figure 3. Power Dissipation
0.1 0.06 0.04
0.02
0.01 0.006
0.4
1.2
2.0
2.8
3.6
4.4
5.2
6.0
VTM, INSTANTANEOUS ONSTATE VOLTAGE (VOLTS)
Figure 4. On-State Characteristics
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Z0103MA, Z0107MA, Z0109MA
R(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED) 1. 0 10 I TSM , PEAK SURGE CURRENT (AMPS)
ZQJC(t) = RQJC(t) @ r(t) 0.1
5.0
3.0 2.0 TJ = 110C f = 60 Hz
CYCLE
Surge is preceded and followed by rated current.
0.01
0.1
1.0
10
100
1*103
1*104
1.0 1.0
2.0
3.0
5.0
10
30
50
100
t, TIME (ms)
NUMBER OF CYCLES
Figure 5. Transient Thermal Response
100 I GT , GATE TRIGGER CURRENT (mA) VGT, GATE TRIGGER VOLTAGE (V) 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0 -40 -25 -10 5 20 35 50 65 80 95 110
Figure 6. Maximum Allowable Surge Current
Q4 Q3 Q2 Q1
10
Q4 Q3 Q2
1
Q1
0.3 -40 -25
-10
5
20
35
50
65
80
95
110
TJ, JUNCTION TEMPERATURE (C)
TJ, JUNCTION TEMPERATURE (C)
Figure 7. Typical Gate Trigger Current versus Junction Temperature
100 10
Figure 8. Typical Gate Trigger Voltage versus Junction Temperature
IL , LATCHING CURRENT (mA)
10
Q2
IH , HOLDING CURRENT (mA)
MT2 Negative 1 MT2 Positive
Q4 1 Q1
Q3
0 -40 -25
-10
5
20
35
50
65
80
95
110
0.1 -40 -25
-10
5
20
35
50
65
80
95
110
TJ, JUNCTION TEMPERATURE (C)
TJ, JUNCTION TEMPERATURE (C)
Figure 9. Typical Latching Current versus Junction Temperature
Figure 10. Typical Holding Current versus Junction Temperature
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Z0103MA, Z0107MA, Z0109MA
LL 200 VRMS ADJUST FOR ITM, 60 Hz VAC TRIGGER CONTROL TRIGGER CHARGE CONTROL MEASURE I RS
1N4007
CS MT2 1N914 51 W G MT1 ADJUST FOR + di/dt(c)
CHARGE
200 V
NONPOLAR CL
Note: Component values are for verification of rated (di/dt)c. See AN1048 for additional information.
Figure 11. Simplified Test Circuit to Measure the Critical Rate of Rise of Commutating Current (di/dt)c
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Z0103MA, Z0107MA, Z0109MA TO-92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL
H2A H2A H2B H2B
H W2 H4 H5 L1 L F1 F2 P2 P1 P P2 D H1 W1 W T T2 T1
Figure 12. Device Positioning on Tape
Specification Inches Symbol D D2 F1, F2 H H1 H2A H2B H4 H5 L L1 P P1 P2 T T1 T2 W W1 W2 2. 3. 4. 5. 6. 7. 8. 9. Tape Feedhole Diameter Component Lead Thickness Dimension Component Lead Pitch Bottom of Component to Seating Plane Feedhole Location Deflection Left or Right Deflection Front or Rear Feedhole to Bottom of Component Feedhole to Seating Plane Defective Unit Clipped Dimension Lead Wire Enclosure Feedhole Pitch Feedhole Center to Center Lead First Lead Spacing Dimension Adhesive Tape Thickness Overall Taped Package Thickness Carrier Strip Thickness Carrier Strip Width Adhesive Tape Width Adhesive Tape Position Item Min 0.1496 0.015 0.0945 0.059 0.3346 0 0 0.7086 0.610 0.3346 0.09842 0.4921 0.2342 0.1397 0.06 - 0.014 0.6889 0.2165 .0059 Max 0.1653 0.020 0.110 0.156 0.3741 0.039 0.051 0.768 0.649 0.433 - 0.5079 0.2658 0.1556 0.08 0.0567 0.027 0.7481 0.2841 0.01968 Millimeter Min 3.8 0.38 2.4 1.5 8.5 0 0 18 15.5 8.5 2.5 12.5 5.95 3.55 0.15 - 0.35 17.5 5.5 0.15 Max 4.2 0.51 2.8 4.0 9.5 1.0 1.0 19.5 16.5 11 - 12.9 6.75 3.95 0.20 1.44 0.65 19 6.3 0.5
Maximum alignment deviation between leads not to be greater than 0.2 mm. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm. Component lead to tape adhesion must meet the pull test requirements. Maximum non-cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive. No more than 1 consecutive missing component is permitted. A tape trailer and leader, having at least three feed holes is required before the first and after the last component. Splices will not interfere with the sprocket feed holes.
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Z0103MA, Z0107MA, Z0109MA
ORDERING & SHIPPING INFORMATION: Packaging Options, Device Suffix
U.S. Europe Equivalent Z0103MARL1G Z0103MAG Z0103MARLRPG Z0103MARLRFG Z0107MARL1G Z0107MAG Z0107MARLRPG Z0107MARLRFG Z0109MARL1G Z0109MAG Z0109MARLRPG Z0109MARLRFG Shipping Radial Tape and Reel (2K/Reel) Bulk in Box (5K/Box) Radial Tape and Fan Fold Box (2K/Box) Radial Tape and Fan Fold Box (2K/Box) Radial Tape and Reel (2K/Reel) Bulk in Box (5K/Box) Radial Tape and Fan Fold Box (2K/Box) Radial Tape and Fan Fold Box (2K/Box) Radial Tape and Reel (2K/Reel) Bulk in Box (5K/Box) Radial Tape and Fan Fold Box (2K/Box) Radial Tape and Fan Fold Box (2K/Box) Description of TO-92 Tape Orientation Flat side of TO-92 and adhesive tape visible N/A, Bulk Round side of TO-92 and adhesive tape visible Round side of TO-92 and adhesive tape on reverse side Flat side of TO-92 and adhesive tape visible N/A, Bulk Round side of TO-92 and adhesive tape visible Round side of TO-92 and adhesive tape on reverse side Flat side of TO-92 and adhesive tape visible N/A, Bulk Round side of TO-92 and adhesive tape visible Round side of TO-92 and adhesive tape on reverse side
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Z0103MA, Z0107MA, Z0109MA
PACKAGE DIMENSIONS
TO-92 (TO-226AA) CASE 029-11 ISSUE AM
A R P L
SEATING PLANE
B
STRAIGHT LEAD BULK PACK
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.021 0.045 0.055 0.095 0.105 0.015 0.020 0.500 --0.250 --0.080 0.105 --0.100 0.115 --0.135 --MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.407 0.533 1.15 1.39 2.42 2.66 0.39 0.50 12.70 --6.35 --2.04 2.66 --2.54 2.93 --3.43 ---
K
XX H V
1
D G J C N N SECTION X-X
DIM A B C D G H J K L N P R V
R
A
B
BENT LEAD TAPE & REEL AMMO PACK
P T
SEATING PLANE
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.40 0.54 2.40 2.80 0.39 0.50 12.70 --2.04 2.66 1.50 4.00 2.93 --3.43 ---
K
G
XX V
1
D J C N SECTION X-X
DIM A B C D G J K N P R V
STYLE 12: PIN 1. MAIN TERMINAL 1 2. GATE 3. MAIN TERMINAL 2
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
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Z0103MA/D

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